Press Releases 

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• UCIe Consortium Releases 2.0 Specification Supporting Manageability System Architecture and 3D Packaging - Beaverton, OR, USA / August 6, 2024
   

• UCIe 2.0 Statements of Support
   

• UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification - Beaverton, OR, USA / August 8, 2023

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• UCIe™ 1.1 Statements of Support

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• UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership - Beaverton, OR, USA / August 2, 2022

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• UCIe™ Consortium Board Statements of Support

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• Leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers join forces to standardize chiplet ecosystem - Beaverton, OR, USA / March 2, 2022